Fabrication of multi-layer substrates for high aspect ratio single crystalline microstructures
نویسندگان
چکیده
This paper reports a new method for making multi-layer substrates (h4LS) for high aspect ratio single crystalline movable microstructures using a group of technologies, such as direct wafer bonding (DWJ3) , chemical mechanical polishing (CMP) , and reactive ion etching (RIE) . As a first example, Si-SiO,-polySi-SiO,-Si sandwich wafers were fabricated using CMP and DWB. Subsequently, free-standing micro cantilever beams and double side clamped bridges were fabricated on these sandwich wafers using a one-run self-aligned RIE process, where polysilicon was used as the sacrificial layer. Polishing and bonding of low pressure chemical vapour deposition (LPCVD) poIysiIicon were studied. An LPCVD Si 3+rN4 polishing stop layer technique was presented to accurately control the final thickness of the device layer. The uniformity of the device layer was improved as well.
منابع مشابه
High Aspect Ratio Single Crystalline Silicon Microstructures Fabricated With Multi Layer Substrates - Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference o
This paper reports a new method for making high aspect ratio Single Crystalline Silicon (SCS) microstructures om multi layer substrates using Chemical Mechanical Polishing (CMP), Silicon Fusion Bonding (SFB) and Reactive Ion Etching (NE) techniques. First Si-Si02-PolySi-Si02-Si sandwich wafers were fabricated using CMP and SFB. Then microstructures were fabricated on these sandwich wafers using...
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